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Ti6Al4V磁控溅射沉积Ag-Cu涂层及其抗菌性能的研究

Preparation of Ag-Cu coating by Ti6Al4V magnetron sputtering and its antibacterial properties
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摘要 钛合金作为植入物广泛应用于医学领域,由于不具备抗菌性能,易造成人体受到细菌感染,随着医用材料对抗菌性能要求的日益提升,亟待开展钛合金抗菌性能研究,以拓展其应用范围。为改善钛合金Ti6Al4V的抗菌性能,采用磁控溅射技术优化工艺参数,在钛合金Ti6Al4V表面制备Ag、Ag-Cu涂层,采用金相显微镜、扫描电子显微镜(SEM)、能谱分析(EDS)、X射线衍射仪(XRD)等表征手段对涂层的表面形貌、微观结构、化学成分分布等性能进行研究;通过体外抗菌活性试验对试样涂层进行抗菌性能检测。实验结果表明,溅射沉积Ag、Ag-Cu涂层对大肠杆菌和金黄色葡萄球菌的抑菌率均为99.99%。由于涂层析出的Ag+、Cu2+起到了抗菌作用,以及Ag、Ti粒子发生了光催化作用,产生了抗菌效果。 Titanium alloys are widely used as implants in the medical field,but they do not have antimicrobial properties and are susceptible to bacterial infections in humans.With the increasing demand for antimicrobial properties in medical materials,there is an urgent need to conduct research on the antimicrobial properties of titanium alloys to expand their applications.In order to improve the antimicrobial properties of titanium alloy Ti6Al4V,Ag and Ag-Cu coatings were prepared on the surface of titanium alloy Ti6Al4V using magnetron sputtering technology to optimize the process parameters,and the surface morphology,microstructure,and chemical composition distribution of the coatings were studied by means of metallographic microscopy,scanning electron microscopy(SEM),energy spectrum analysis(EDS),X-ray diffractometer(XRD),and other characterization methods.The surface morphology,microstructure,chemical composition distribution and other properties of the coatings were investigated;the antibacterial properties of the coatings were tested by in vitro antibacterial activity test.The results show that the sputter-deposited Ag and Ag-Cu coatings have 99.99%inhibition of escherichia coli and ttaphylococcus aureus.The Ag+and Cu2+precipitated from the coatings played an antibacterial role,the Ag and Ti particles underwent photocatalysis,which produced the antibacterial effect.
作者 丁结平 丁佳 高波 徐晋勇 DING Jieping;DING Jia;GAO Bo;XU Jinyong(School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China)
出处 《桂林电子科技大学学报》 2024年第3期274-280,共7页 Journal of Guilin University of Electronic Technology
关键词 磁控溅射 钛合金 Ag-Cu涂层 Ag涂层 抗菌 magnetron sputtering titanium alloy Ag-Cu coating Ag coating antibacterial
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