等离子清洗在航空电子产品印制板组件三防工艺中的应用

Application of Plasma Cleaning in Three-proof Technology of Printed Board Assembly of Avionics Products

为了解决航空电子产品印制板组件三防拒润湿的工艺问题,采用机理探究、等离子清洗和可靠性试验的方法,最终得出结论:在0.2 mPa气压下,功率为400 W时,等离子清洗速度为40~50 cm/s,清洗头距离清洗表面15~20 mm,清洗后2小时内完成航空电子产品印制板组件三防喷涂的工艺方法可行且有效。等离子清洗可以稳定地解决航空电子产品印制板组件拒润湿的三防工艺问题。

In order to solve the process problem of three-proof and anti-wetting of printed circuit board assembly of avionics products,the mechanism exploration,plasma cleaning experiment and reliability test are adopted,and the results show that plasma cleaning could significantly improve the surface activity and three-proof reliability of printed circuit board assembly of avionics products.Finally,it is concluded that the plasma cleaning speed is 40~50 cm/s and the cleaning head is 15~20 mm away from the cleaning surface,and it is completed within 2 hours after cleaning.Plasma cleaning can stably solve the three-proof process problem of anti-wetting of printed board components of avionics products.