低温共烧陶瓷工艺激光开孔研究

Study on Laser Drilling of Low Temperature Co-fired Ceramics

低温共烧陶瓷元件内部层与层之间的电气连接是通过开孔后再填入金属浆料来实现的。为满足信号互连的需求,低温共烧陶瓷生瓷带上金属化通孔质量至关重要,其中包括开孔和填孔工艺。高质量的开孔是确保填孔质量的基础前提。分析30μm厚的低温共烧陶瓷白色生瓷带上CO_(2)型激光开孔质量,并解决环形开孔方式中局部穿孔或生瓷残留的问题。最后,提出一套普适且高效的激光环形开孔程序设计方法。实验结果表明,通过工艺改进及设计优化,孔径100μm以上开孔的质量明显改善。

This paper examines the critical aspects of metallized through-hole quality in low-temperature co-fired ceramic(LTCC) components, focusing on the hole opening and filling processes. The quality of hole opening is fundamental to ensuring the subsequent filling process. The study analyzes the performance of CO_(2) laser drilling on the white raw material belt of 30-micron-thick LTCC, addressing issues such as local perforation and residual raw ceramic material in the annular drilling mode. A universal and efficient program design method for laser annular drilling is proposed, which significantly improves the quality of apertures larger than 100 μm through process enhancement and design optimization.