高算力Chiplet的热管理技术研究进展

Research Progress on Thermal Management Technology of High-Computational-Power Chiplet

随着集成电路尺寸微缩逼近物理极限以及受限于光罩面积,芯粒(Chiplet)技术将成为集成电路发展的关键路径之一,支撑人工智能和高性能计算不断发展。大尺寸、高算力Chiplet面临着热功耗高、热分布不均、热输运困难等挑战,Chiplet热管理已成为后摩尔时代集成电路发展的重大挑战之一。综述了可用于Chiplet热管理的关键技术发展趋势和现状,包含微通道冷却、相变冷却、射流冷却、浸没式冷却、热界面材料(TIM)、热分布不均的解决办法、多物理场耦合的研究等,为推进大尺寸、高算力Chiplet热管理的实际应用提供参考。

With integrated circuit size shrinking close to the physical limit and the limitation of photomask area,Chiplet technology will become one of the key paths for the development of integrated circuits,supporting the continuous development of artificial intelligence and high-performance computing.The large-size and high-computational-power Chiplets are faced with the challenges of high thermal power consumption,uneven thermal distribution and difficult thermal transport,and the Chiplet thermal management has become one of the major challenges in the development of integrated circuits in the post-Moore era.The development trend and current status of key technologies that can be used for Chiplet thermal management are reviewed,including microchannel cooling,phase change cooling,jet cooling,immersion cooling,thermal interface material(TIM),solutions to uneven thermal distribution and research on multi-physics field coupling,which provide a reference for promoting the practical application of Chiplet thermal management with large size and high computational power.