Effects of cold rolling path on recrystallization behavior and mechanical properties of pure copper during annealing

冷轧路径对纯铜在退火过程中再结晶行为和力学性能的影响

The recrystallization behavior,grain boundary characteristic distribution,and mechanical properties of pure Cu sheets that were subjected to different cold rolling paths,and then annealed at 400°C for 10,30,60,and 420 min,were investigated.Different rolling paths changed the grain boundary orientations of cold-rolled copper,causing recrystallized grains to nucleate and grow in an oriented manner.However,the evolution of the texture indicated that cold-rolled copper with different rolling paths did not show an obvious preferred orientation after annealing.The RD-60 specimen exhibited the smallest grain size(6.6μm).The results indicated that the grain size and low-ΣCSL grain boundaries worked together to provide RD-60 samples with appropriate mechanical properties and high plasticity.The yield strength,ultimate tensile strength,and elongation of RD-60 sample were 81 MPa,230 MPa,and 49%,respectively.These results could provide guidance for tuning the microstructures and properties of pure Cu foils,as well as designing fabrication routes for pure Cu foils through processes such as rolling and drawing.

研究了不同冷轧路径的纯铜在400℃退火10、30、60和420 min过程中的再结晶行为、晶界特征分布以及力学性能。不同的轧制路径改变了冷轧铜的晶界取向,导致再结晶晶粒定向成核和长大;而织构演变表明,不同轧制路径的冷轧铜在退火后没有表现出明显的择优取向。RD-60样品的晶粒尺寸最小(6.6μm)。结果表明,在晶粒尺寸和低∑CSL晶界共同作用下,RD-60样品具有较好的力学特性和高塑性,其屈服强度、极限抗拉强度和伸长率分别为81 MPa、230 MPa和49%。这些结果可以为调整纯铜箔的微观结构和性能,以及通过轧制和拉拔等工艺设计为纯铜箔的制造路线提供指导。