高深宽比粘接式歧管微通道换热器性能研究

Performance investigation of bonded manifold microchannel heat exchanger with high aspect ratio

半导体和其他微尺度电子技术的迅速发展导致芯片功率密度急剧增加,而功率的增加使电子设备的散热面临严峻挑战,微通道换热器则可以有效解决电子设备的散热问题。文章设计了一种微通道深宽比(aspect ratio,AR)高达10.5且单个歧管微通道换热器尺寸为13.00 mm×12.00 mm×0.88 mm的粘接式歧管微通道换热器,并从热点温度、热阻、系统压降3个方面评估换热器冷却模块的热工性能和水力性能。研究结果表明,当以去离子水为工作介质且水的体积流量为150 mL/min时,换热器在芯片温度为82.1℃、总热阻为0.052 cm^(2)·K/W、压降为260 kPa时,散热高达1200 W/cm^(2)。该研究为使用单相水来冷却高热通量的电力电子设备提供了一种新的思路。

The rapid development of semiconductors and other micro-scale electronic technologies has led to a dramatic increase in chip power density.The increase in power poses a severe challenge to the heat dissipation of electronic devices,and microchannel heat exchangers can effectively solve the heat dissipation problem of these devices.In this paper,a bonded manifold microchannel heat exchanger was developed with a size of 13.00 mm×12.00 mm×0.88 mm and an aspect ratio(AR)of microchannels of up to 10.5.The thermal and hydraulic performance of the cooling module was evaluated in terms of hot spot temperature,thermal resistance,and system pressure drop.The results show that when deionized water is used as the working medium and the water flow is 150 mL/min,the heat exchanger dissipates up to 1200 W/cm^(2)heat flux at a chip temperature of 82.1℃,a total thermal resistance of 0.052 cm^(2)·K/W and a pressure drop of 260 kPa.The present work provides a new strategy for using single-phase water to cool power electronics with high heat flux.