AOI自动化光学检测技术的应用

Design Method for Optimal Systematic Error of Space Carrier Technology

厚度作为半导体薄膜的一个关键参数,直接影响着其工作性能.然而,对于市面上使用较为广泛的微米级厚度的半导体衬底、晶圆片,现存测量方法仍存在精度不够、稳定性差、测量速度较慢等问题.为了解决这一问题,基于红外干涉测厚原理与激光面形检测原理,构建了一个高精度、小型化、低成本的半导体薄膜厚度自适应测量校正系统.实验结果表明,相比于传统的红外干涉测厚系统,使用构建的薄膜厚度测量校正系统可以使测量结果的精确性提升约 80%,稳定性提升约 60%,即使在测量带有倾斜分量的半导体薄膜厚度时,也可以达到同样的效果.该系统实现了对单层薄膜厚度的精确测量,并能够自适应地校正由机械震动或摆放失误导致薄膜产生微小倾角所引入的误差,为解决现有技术在微米级薄膜厚度测量方面所面临的挑战提供了一个解决方案.

thickness,as a key parameter of semiconductor films,directly affects their working performance.However,for semiconductor substrates and wafers with micrometer thickness,which are more widely used in the market,the existing measurement methods still have problems such as insufficient accuracy,poor stability and slow measurement speed.In order to solve these problems,this study constructs a high-precision,miniaturized,and low-cost semiconductor thin-film thickness adaptive measurement and correction system based on the principle of infrared interferometric thickness measurement and the principle of laser surface shape detection.Experimental results show that compared with the traditional infrared interferometric thickness measurement system,the film thickness measurement correction system constructed using this paper can improve the accuracy of the measurement results by about 80%and the stability by about 60%,even when measuring the thickness of semiconductor thin films with a tilted component,the same effect can be achieved.The system achieves accurate measurement of the thickness of a single film layer and is able to adaptively correct errors introduced by mechanical vibrations or placement errors that result in small inclinations of the film,providing a solution to the challenge of measuring the thickness of micrometer-sized films with existing techniques.