无铅钎料焊点界面组织及性能研究进展

Research Progress on Microstructure and Properties of Lead-free Solder Joints

近年来,电子元件因其小型化、高效性、多功能性、高集成化等特点逐渐成为人们不可或缺的设备。在电子封装领域,钎焊技术应用广泛。在钎焊过程中钎料在基板上的润湿性会影响元件与基板互连,并且在焊点处形成的界面金属间化合物的显微组织和生长行为会影响接头性能,从而影响焊点可靠性。欲获得优质焊点,可通过改变钎料成分如添加纳米颗粒、对基板化学镀或合金化、控制钎焊工艺参数、时效处理来实现。总结了国内外学者针对上述举措对界面润湿性及接头组织性能的影响所进行的研究,可为后续的研究提供一定的参考和借鉴。

In recent years,electronic components have gradually become indispensable equipment because of their miniaturization,high efficiency,versatility and high integration.Brazing technology is widely used in the field of electronic packaging.However,in the process of brazing,the wettability of the filler metal on the substrate will affect the interconnection between the component and the substrate,and the microstructure and growth behavior of the intermetallic compounds formed at the solder joint will affect the joint performance,thus affecting the reliability of the solder joint.In order to obtain high quality solder joints,it can be achieved by changing the composition of the filler metal such as adding nanoparticles,electroless plating or alloying of the substrate,controlling brazing process parameters and aging treatment.The research of domestic and foreign scholars on the influence of the above factors on the interface wettability,microstructure and properties of joint was summarized in detail,which can provide certain reference for the subsequent research.