串联IGBT组件失效机理及可靠性分析

Failure Mechanism and Reliability Analysis of Series IGBT Components

高压大容量电力电子装备需要将多个功率绝缘栅双极型晶体管(IGBT)串联以提高其耐压等级,受器件寄生参数及外围电路影响,串联IGBT组件开关动作时存在不同程度的均压问题。此处首先分析了动态均压程度对串联IGBT组件的失效影响原理;其次,以三相两电平换流器为例,建立了串联IGBT组件等效模型,并提出了计及动态均压程度影响的串联IGBT组件的可靠性分析方法;最后,基于模型和实验数据揭示了不同工况下动态均压程度对串联IGBT组件的可靠性影响。

High voltage and large capacity power electronic equipment needs many series the insulated gate bipolar transistors(IGBT)to improve its voltage resistance level.Due to the influence of device parasitic parameters and pe-ripheral circuits,the switching action of series IGBT components has different degrees of voltage equalization problem.Firstly,the failure principle of series IGBT components affected by dynamic voltage equalization degree is analyzed.Secondly,the equivalent model of series IGBT components is established by taking the three-phase two-level converter as an example,and the reliability analysis method of series IGBT components is proposed by taking the influence of dyn-amic voltage equalization degree into account.Finally,based on the model and experimental data,the influence of dynam-ic voltage equalization degree on the reliability of series IGBT components under different working conditions is revealed.