CuO掺杂对KNN基无铅压电陶瓷微观结构的影响

Effects of CuO Doping on Microstructure of KNN-Based Ceramics

为了解不同掺杂量的助熔剂CuO对KNN基无铅压电陶瓷微观结构的影响,采用固相烧结工艺制备KNN+1.5%ZnO+x%CuO(x=0、1.0、1.5、2.0、2.5、3.00,摩尔百分数)无铅压电陶瓷样品,研究CuO对KNN+1.5%ZnO基无铅压电陶瓷体积密度、相结构以及微观结构的影响。结果表明,掺杂CuO和ZnO后,KNN基无铅压电陶瓷的致密度在一定程度上有了提高,且助熔剂与压电陶瓷经烧结后可完全固溶。随着CuO掺杂量的增大,陶瓷的颗粒尺寸有增大趋势。当掺杂2%CuO时,无铅压电陶瓷样品最致密,其密度为4.28 g/cm^(3)。

In order to understand the effect of different doping amounts of flux CuO on the microstructure of KNN lead-free piezoelectric ceramics,samples of KNN+1.5%ZnO+x%CuO(x=0,1.0,1.5,2.0,2.5,3.00,mole percent)are prepared by solid phase sintering process.The effects of CuO on the bulk density,phase structure and microstructure of KNN+1.5%Zno-based lead-free piezoelectric ceramics are investigated.The results show that the density of KNN lead-free piezoelectric ceramics is improved to a certain extent after doping CuO and ZnO,and the flux and piezoelectric ceramics can be completely solid dissolved after sintering.The ceramic particles grow bigger with the increase of the doping amount of CuO.When 2%CuO is doped,the lead free piezoelectric ceramic sample is the densest,its density is 4.28 g/cm^(3).