摘要
聚乙二醇(PEG)是电解铜箔制备过程中常用的润湿剂,具有细化晶粒、整平镀层的作用,同时还可调节镀层的力学性能,现有文献针对PEG浓度大小对电解铜箔性能影响研究较多,而系统研究PEG分子量大小对电解铜箔性能影响鲜有报道。本研究使用分子量为200、1000、4000和8000的聚乙二醇(PEG)作为电解铜箔的添加剂,在Cl-存在的情况下,制备出添加不同分子量PEG的电解铜箔,探究PEG分子量的大小对铜的电沉积行为、铜箔的表观形貌、质重和厚度、M面亮度和粗糙度以及抗拉强度和延伸率的影响。结果表明,当PEG分子量为200时,对铜的电沉积表现为促进作用,制备出的电解铜箔与未添加PEG相比,表面晶粒尺寸稍大,粗糙度升高,抗拉强度和延伸率有所降低;当PEG分子量为1000、4000和8000时,对铜的电沉积表现为抑制作用,且抑制效果为4000>1000>8000,此时制备的铜箔表面晶粒尺寸减小且变得平整均匀,粗糙度降低,抗拉强度和延伸率也有所提升,尤其是当PEG分子量为4000时,制备出的电解铜箔的性能最优,M面粗糙度由3.79降至2.79,抗拉强度和延伸率分别提升了43%和114%;不同分子量PEG对铜箔的质重、厚度及M面亮度影响不大。本研究结果为电解铜箔时选择适宜分子量PEG提供了参考。
Polyethylene glycol(PEG)is a commonly used wetting agent in the preparation of electrolytic copper foil,which can refine the grain,smooth the coating,and adjust the mechanical properties of the coating.There are many studies on the effect of PEG concentration on the properties of electrolytic copper foil in the existing literature,but there are few reports on the effect of PEG molecular weight on the properties of electrolytic copper foil.In this stduy,polyethylene glycol(PEG)with molecular weight of 200,1000,4000 and 8000 is used as the additive of electrolytic copper foil.In the presence of Cl-,electrolytic copper foil with PEG of different molecular weight is prepared by electroplating process.The effects of PEG molecular weight on copper electrodeposition behavior,surface appearance,mass weight and thickness,M⁃surface brightness and roughness,tensile strength and elongation were investigated.The results show that when the molecular weight of PEG is 200,the electrodeposition of copper is promoted,Compared with the electrolytic copper foil without PEG,the surface grain size is slightly larger,the roughness is increased,and the tensile strength and elongation are decreased.When the molecular weight of PEG is increased to 1000,4000 and 8000,the electrodeposition of copper is inhibited,and the inhibition effect is 4000>1000>8000.At this time,the surface grain size of the prepared copper foil decreases and becomes flat and uniform,the roughness decreases,and the tensile strength and elongation also increase.Especially when the PEG molecular weight is 4000,the performance of the prepared electrolytic copper foil is the best,the M⁃surface roughness decreases from 3.79 to 2.79,and the tensile strength and elongation increase by 43%and 114%,respectively.PEG with different molecular weight has little effect on the mass weight,thickness and M⁃surface brightness of copper foil.The results of this study provide a reference for the selection of appropriate molecular weight PEG in electrolysis of copper foil.
作者
樊斌锋
董玉佳
王庆福
王坤
朱石林
程润润
FAN Binfeng;DONG Yujia;WANG Qingfu;WANG Kun;ZHU Shilin;CHENG Runrun(Henan High Precision Copper Foil Industrial Technology Research Institute Co.,Ltd.,Lingbao 472500,China)
出处
《中国有色冶金》
CAS
北大核心
2024年第5期17-22,共6页
China Nonferrous Metallurgy
关键词
电解铜箔
电沉积
聚乙二醇(PEG)
分子量
添加剂
力学性能
粗糙度
electrolytic copper foil
electrodeposition
polyethylene glycol(PEG)
molecular
additives
mechanical property
roughness