碳钢在氯化胆碱-乙二醇室温离子液体中电沉积铜镍镀层的机理与性能表征

Mechanism and property characterization of electrodeposited copper-nickel coatings on carbon steel in choline chloride-ethylene glycol room temperature ionic liquid

以氯化胆碱-乙二醇离子液体作为电解液溶剂,在Q235碳钢表面采用电沉积法制备了铜镍(Cu-Ni)合金镀层。通过分析各体系电解液的循环伏安曲线,判断电沉积过程金属离子的共沉积机理,结果显示Cu、Ni在此体系下容易实现共沉积。文中考察了电流密度的变化对镀层的微观形貌以及镀层的耐腐蚀性的影响,结果表明,随着电流密度增大,镀层中镍含量逐渐增大,镀层晶粒形貌也随之发生了显著变化;当电流密度从-1.5 mA/cm^(2)增加到-4.0 mA/cm^(2)时,镀层的耐腐蚀性先增大后减小,电流密度为-3.0 mA/cm^(2)时,所得镀层的耐腐蚀性较优。

Copper-nickel(Cu-Ni)alloy coatings were prepared on Q235 carbon steel substrate by electrodeposition method using choline chloride-ethylene glycol room temperature ionic liquid as the electrolyte solvent.By analyzing the cyclic voltammetry curves of electrolytes from each system,the co-deposition mechanism of metal ions in the electrodeposition process was determined.The results show that the co-deposition of Cu and Ni is easy to achieve in this system.The effects of the current density variation on the micro-morphology of the coating and the corrosion resistance of the coating were investigated.The results indicate that the nickel content in the plated layer increase with the increase in current density,and the grain morphology of the plated layer also changes significantly with the change in current density.When the current density increases from -1.5 mA/cm^(2) to -4.0 mA/cm^(2),the corrosion resistance of the coating increases first and then decreases,and when the current density is -3.0 mA/cm^(2),the corrosion resistance of the obtained coating is optimal.