晶圆键合台温度均匀性提升研究

Research on Improving Temperature Uniformity of Wafer Bonding Platforms

为提升集成电路用晶圆键合台的温度均匀性,以当前主流的200 mm晶圆键合台为研究对象,开展了键合台升温实验,建立并验证了键合过程三维热量传递数值模型,研究了键合台内部温度形成与分布规律,提出了能够显著提升键合台温度均匀性的简便有效策略。结果表明:加热盘内部加热丝缠绕的非中心对称分布引起键合台工作面温度的不均匀分布,在不考虑上、下加热盘高低温区匹配的情况下,工作面整体温度均匀性为3.2%,径向温度均匀性为1.1℃;对上或下加热盘进行旋转,使得两个加热盘的高低温区分布形成空间补偿,可大幅提升键合台温度均匀性;在将上加热盘逆时针匹配旋转50°后,键合台工作面的整体温度均匀性达到1.3%,径向温度均匀性达到0.3℃。该研究有助于深入认识晶圆键合台内部的热量传递与温度分布规律,对于键合台的精细设计和键合工艺水平的提升具有参考意义。

To enhance the temperature uniformity of wafer bonding platforms for integrated circuits,the mainstream^(2)00 mm wafer bonding platform is selected as the subject of research,and heating experiments are conducted on this platform.A three-dimensional heat transfer numerical model of the bonding process is developed and validated to study the temperature formation and distribution within the bonding platform.A simple and effective strategy is proposed to significantly improve the temperature uniformity of the bonding platform.The research findings reveal that the non-centrally symmetrical distribution of heating wires wound inside the heating plate leads to uneven temperature distribution on the working surface of the bonding platform.Without considering the alignment of high and low-temperature zones of the upper and lower heating plates,the overall temperature uniformity of the working surface is 3.2%,with a radial temperature uniformity of 1.1℃.Rotating either the upper or lower heating plate provides spatial compensation for the distribution of high and low-temperature zones of the two heating plates,resulting in a substantial enhancement in the temperature uniformity of the bonding platform.Following a 50°counterclockwise rotation of the upper heating plate,the overall temperature uniformity of the working surface of the bonding platform achieves 1.3%,with the radial temperature uniformity reaching 0.3℃.This research contributes to a deeper comprehension of heat transfer and temperature distribution within the wafer bonding platform,which is of reference significance to the fine design of bonding platforms and the improvement of the bonding processes.