无铅热风整平焊锡板锡咬铜改善研究

Study on the improvement of“tin etching copper”in leadfree HASL boards

无铅热风整平焊锡(HASL)技术作为环保要求下的重要工艺变革,广泛应用于印制电路板(PCB)表面处理中。然而,该技术在提高环保性能的同时,也面临着“锡咬铜”问题的挑战,这直接影响到PCB的电气性能和长期可靠性。探讨无铅HASL板中锡咬铜现象的原因、影响因素和改善策略,为提升无铅HASL板品质提供科学依据。

Lead-free hot air solder leveling(HASL)technology,as an important process change under the environmental requirements,is widely used in the surface treatment of printed circuit boards(PCBs).However,while improving environmental performance,the technology also faces the challenge of"tin etching copper",which directly affects the electrical performance and long-term reliability of PCBs.The purpose of this paper is to discuss the causes,influencing factors and improvement strategies of the tin etching copper phenomenon in HASL,so as to provide a scientific basis for improving the quality of lead-free HASL PCB.