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低介电低热膨胀聚酰亚胺材料的制备与性能

Preparation and Performance of Low Dielectric Constant and Low Thermal Expansion Polyimide Materials
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摘要 采用均苯四甲酸二酐(PMDA),4,4′-二氨基二苯醚(ODA),经二步法合成了一系列聚酰胺酸(PAA)溶液,随后与云母或海泡石浆料混合,经流延涂膜、去溶剂和亚胺化等步骤制备了一系列聚酰亚胺(PI)复合膜。利用傅里叶变换红外光谱仪、静态热机械分析仪,阻抗分析仪对PI复合膜结构和性能进行了研究。结果表明:所制备的PI复合膜具有优异的综合性能,尤其是尺寸稳定性和介电性能。当云母质量分数为15%时,PI云母复合膜的热膨胀系数为28.68×10^(-6)/K,介电常数为2.58 F/m。 A series of polyamic acid(PAA)solutions were synthesized by two-step method using pyromellitic dianhydride(PMDA)and 4,4′-diaminodiphenyl ether(ODA).It is then mixed with mica or sepiolite slurry.After casting film coating,solvent removal and imidization,a series of polyimide(PI)composite films were prepared.Structures and properties of PI composite films were studied by Fourier transform infrared spectrometer,static thermo-mechanical analyzer and impedance analyzer.The results show that the PI composite films have excellent comprehensive properties,especially dimensional stability and dielectric properties.When the mica mass fraction is 15%,the thermal expansion coefficient of PI mica composite film is 28.68×10^(-6)/K,and the dielectric constant is 2.58 F/m.
作者 徐湘月 徐勇 曾炜 宋超然 汤学妹 蒋家祥 Xu Xiangyue;Xu Yong;Zeng Wei;Song Chaoran;Tang Xuemei;Jiang Jiaxiang(School of Chemistry and Chemical Engineering,Nanjing University of Science and Technology,Nanjing,Jiangsu,210094;Institute of Chemical Engineering,Guangdong Academy of Sciences,Guangzhou,Guangdong,510665;R&D Centre,Nanjing Zhonghong Running Advanced Material Technology Co.,Ltd.,Nanjing,Jiangsu,210028;Department of R&D,Polyimide(Suzhou)Technology Co.,Ltd.,Suzhou,Jiangsu,215011)
出处 《现代塑料加工应用》 CAS 北大核心 2024年第4期5-8,共4页 Modern Plastics Processing and Applications
基金 国家自然科学基金面上项目(52073066) 广东省科学院建设国内一流研究机构行动专项资金(2020GDASYL-20200120028)。
关键词 聚酰亚胺复合膜 介电性能 热膨胀系数 polyimide composite film dielectric property thermal expansion coefficient
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