期刊文献+

T/R组件半水清洗工艺

Semi-aqueous Cleaning Technology for T/R Modules
下载PDF
导出
摘要 T/R组件的清洗是雷达电子产品装联中重要的工序,清洗的质量对T/R组件的可靠性影响很大。T/R组件结合半水清洗工艺从清洗温度、清洗时间、漂洗温度、漂洗时间等方面分析研究。通过重新设计清洗工装和优化清洗方法,得出一种新的清洗工艺,可实现大批量、多品种、异形结构和深腔结构的T/R组件同时批量清洗,提高军工产品的清洗效率,满足军工产品批量生产中高可靠性的清洗要求。 The cleaning of T/R modules is an important process in the assembly of radar electronic products,and the quality of cleaning has a significant influence on the reliability of T/R modules.T/R module combined with semi-aqueous cleaning technology is analyzed and studied from the aspects of cleaning temperature,cleaning time,rinsing temperature,rinsing time,etc.By redesigning the cleaning fixture and optimizing the cleaning method,a new cleaning process is developed to achieve simultaneous batch cleaning of T/R modules with large quantities,multiple varieties,irregular structures and deep cavity structures,which can improve the cleaning efficiency of military products and meet the high reliability cleaning requirements in the mass production of military products.
作者 杨帆 尤玉山 王亚松 邝小乐 YANG Fan;YOU Yushan;WANG Yasong;KUANG Xiaole(The 8th Research Academy of CSSC,Nanjing 211153,China)
出处 《电子工艺技术》 2024年第6期33-37,共5页 Electronics Process Technology
关键词 T/R组件 清洗工艺 助焊剂残留物 T/R modules cleaning process flux residue
  • 相关文献

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部