摘要
二维材料的本征特性难以满足高性能器件与系统的需求;同时,极小尺寸器件的制备对二维材料的高精度加工又提出了新的需求。因此,能够进行二维材料减薄、切割等加工以及氧化还原、相变、诱导缺陷等改性的后处理技术成为了实现二维材料纳米器件性能提升的关键技术。对几种常见的二维材料后处理技术进行总结,包括化学掺杂、应变工程、等离子处理与光辐照技术;分析不同处理方法的主要原理及特点,以及处理后的二维材料尺寸、结构以及性能变化。在此基础上,探讨了二维材料后处理技术在研制新型纳米电子器件中的应用,包括器件性能的改善以及新型器件结构的实现,尤其是对纳米忆阻器研制的推动作用,为包括人工神经计算网络在内的新型电子及计算系统的实现与发展提供了新的思路。
The intrinsic properties of two-dimensional(2D)materials often fall short of the requirements for highperformance devices and systems.Additionally,the fabrication of extremely small-sized devices has introduced new demands for high-precision machining of 2D materials.Consequently,post-processing techniques that facilitate the modification of 2D materials,encompassing processes such as thinning,oxidation,reduction,phase transitions,and defect induction,have become imperative for the commercialization of nano-devices founded on 2D materials.This article primarily consolidates several prevalent post-processing techniques for 2D materials,encompassing chemical doping,strain engineering,plasma treatment,and light irradiation.The core principles and distinctive features of these methods are succinctly summarized to elucidate the alterations in the dimensions,structures,and properties of 2D materials following postprocessing.Subsequently,the article delves into the application of post-processing techniques for 2D materials in the realm of novel nano-devices.This encompasses enhancements in performance and the development of new devices,with particular emphasis on the pivotal role these techniques play in the evolution of cutting-edge nanoscale memristors.These advancements proffer fresh perspectives for the realization and progression of various electronic devices and computational systems.
作者
王根旺
潘鹏辉
李宝霞
WANG Genwang;PAN Penghui;LI Baoxia(Xi'an Microelectronics Technology Institute,Xi'an 710054,China)
出处
《微电子学与计算机》
2024年第11期109-119,共11页
Microelectronics & Computer