一种小型化穿透式液冷机箱设计与仿真研究

Research on Simulation Design of Low Temperature Heating Technology for An AI Chip Module

为满足机载电子设备小型化、轻量化、高功耗、低成本的应用需求,本文设计了一种结合穿透式液冷和自然对流两种散热方式的机箱结构,对液冷板流道流阻进行了理论计算和仿真研究;针对设备中占主要功耗的国产高性能计算模块处理器运行温度高的问题,对冷板内部流道进行优化设计和仿真研究,结果表明,迂回点阵型肋片式流道能够有效提升冷却介质的换热效率,处理器芯片结温下降约17℃,实现了飞腾国产化高性能处理平台在小型化机载电子设备上可靠应用。

In order to meet the application requirements of miniaturization,lightweight,high power consumption,and low cost of airborne electronic equipment,this paper designs a chassis structure that combines two heat dissipation methods;penetrating liquid cooling and natural convection.Theoretical calculations and simulation studies are conducted on the flow resistance of the liquid cooling plate channel;In response to the problem of high operating temperature of the domestic high-performance computing module processor,which accounts for the main power consumption in the device,optimization design and simulation research were carried out on the internal flow channel of the cold plate.The results showed that the meandering point array ribbed flow channel can effectively improve the heat transfer efficiency of the cooling medium,and the junction temperature of the processor chip decreased by about 17,realizing the design and application of the domestically produced high-performance processing platform of Feiteng on miniaturized airborne recorders.