嵌入合金框架的扇出型板级封装结构及其翘曲仿真分析

Fan-Out Panel-Level Packaging Structure with Embedded Alloy Frame and Its Warpage Simulation Analysis

扇出型板级封装(FOPLP)依靠其小线宽/线距、高集成度、小尺寸等优势,从封装角度形成集成电路的优解,实现摩尔定律的延续。针对FOPLP的大尺寸带来的翘曲及可靠性问题,提出在封装载板内嵌入TC4钛合金框架,研究TC4钛合金框架的尺寸参数对翘曲的影响。采用有限元仿真分析方法评估了TC4钛合金框架的长度、宽度及厚度对封装翘曲的影响。随着TC4钛合金框架尺寸参数的增大,封装翘曲均有所降低。此外,利用正交分析实验分析了尺寸参数对翘曲的交互效应,得到了关键参数的最佳窗口。利用阴影云纹法测量产品,得到的翘曲结果与仿真结果展现出较好的一致性。

Fan-out panel-level packaging(FOPLP)relies on its advantages of small line width/spacing,high integration density,and small size to form an optimal solution for integrated circuits from a packaging perspective,achieving the continuation of Moore's Law.To address the warpage and reliability problems caused by the large size of FOPLP,a TC4 titanium alloy frame is proposed to be embedded in the packaging carrier board,and the influence of size parameters of the TC4 titanium alloy frame on the warpage is studied.The influence of length,width and thickness of TC4 titanium alloy frame on packaging warpage is evaluated by finite element simulation analysis method.With the increase of the size parameters of TC4 titanium alloy frame,the warpages of the packaging are reduced.In addition,the interaction effect of dimension parameters on warpage is analyzed by orthogonal analysis experiment,and the optimal window of key parameters is obtained.The warpage results obtained by measuring the product using shadow moirémethod show good consistency with the simulation results.