基于专利分析的半导体金刚石磨抛技术发展态势研究

Research on the Development Trend of Semiconductor Diamond Polishing Technology Based on Patent Analysis

近年来,金刚石以其独特的物理属性,被视为下一代半导体电子器件的核心材料,高效、高精密的磨抛技术成为半导体金刚石产业化应用的关键技术。本文基于专利分析视角,对全球金刚石磨抛技术发展态势和关键技术进行研究,通过深入分析专利申请趋势、技术分支、地域布局、技术流向、关键技术等,揭示金刚石磨抛技术国内外发展现状、技术布局以及研究热点和主要研发方向,最后提出了金刚石磨抛技术发展的相关建议,力求为创新主体引导发展半导体金刚石磨抛技术、提升行业产业专利运用价值提供参考。

In recent years,diamond has been regarded as the core material for the next generation of semiconductor electronic devices due to its unique physical properties,and efficient and high-precision grinding and polishing technology has become a key technology for the industrial application of semiconductor diamond.Based on the perspective of patent analysis,this article studies the development trend and key technologies of global diamond grinding and polishing technology.Through in-depth analysis of patent application trends,technology branches,geographical layout,technology flow,key technologies,etc.,it reveals the current development status,technology layout,research hotspots and main research directions of diamond grinding and polishing technology at home and abroad.Finally,it proposes relevant suggestions for the development of diamond grinding and polishing technology in China,striving to provide reference for innovation entities to guide the development of semiconductor diamond grinding and polishing technology and enhance the value of industry patent utilization.