超薄硅基VC的实验研究

Experimental Study on an Ultra-thin Silicon-Based Vapor Chamber

电子器件小型化和集成化导致芯片热流密度升高,并使在受限空间内的散热变得具有挑战性。硅基蒸汽腔(Vapor chamber,VC)提供了一种简单、可靠且易于集成的散热方案。本文设计并制作了一款尺寸为7 mm×7 mm×0.6 mm的超薄硅基VC,搭建了实验系统,探究了三种工质(2100A、无水乙醇、去离子水)对硅基VC传热性能的影响。实验结果表明,以无水乙醇为工质的硅基VC热阻最低,相较于未充液的VC热阻降低了61.4%,以去离子水为工质的硅基VC在高热负荷下表现出最优的均温性能。

The miniaturization and integration of electronic devices have led to the increase of chips heat flux,making heat dissipation in confined spaces increasingly challenging.Silicon-based vapor chambers(VC)provide a simple,reliable,and easily integrable solution.An ultra-thin silicon-based VC with dimensions of 7 mm×7 mm×0.6 mm was designed and fabricated in this study.An experimental system was set up to investigate the impact of three working fluids(2100A,anhydrous ethanol,and deionized water)on the heat transfer performance of the silicon-based VC.Experimental results show that the silicon-based VC using anhydrous ethanol has the lowest thermal resistance,reducing thermal resistance by 61.4%compared to the unfilled VC.Additionally,the silicon-based VC using deionized water demonstrates the best temperature uniformity performance under high heat loads.