倒装焊接机调平问题的研究

Research on Leveling Problem of Flip Welding

倒装互连工艺是制冷型红外焦平面探测器制备的关键技术之一,Z向压偏问题是影响倒装互连工艺成品率的重要因素。从倒装焊接机的设备角度,讨论了倒装焊接机调平与Z向压偏问题的关联性。测量的校准块不同位置焦距数值、标定校准块中点的准直十字位置粗略表明上焊臂与下基台的相对平行。此外,采用激光束获取的上下两个标准块不同位置与激光器的距离,精确表明上焊臂与下基台的空间平行,验证了倒装焊接机调平的准确度。首次建立研究倒装焊接机调平问题的方法体系,为高效解决倒装互连工艺Z向压偏问题、提升红外焦平面探测器成品率和可靠性打下了良好基础。

The flip interconnect process is one of the key technologies for the preparation of infrared focal plane detectors.The Z-direction bias is an important factor affecting the yield of the flip interconnect process.From the point of view of the equipment of flip welding machine,the relationship between the level of flip welding machine and the Z-direction pressure deviation problem is discussed.The measured focal length values of different positions of the calibration block and the collimation cross position of the center point of the cali-bration block roughly indicate that the upper welding arm is relatively parallel to the lower abasement.In addi-tion,the distances between the two standard blocks and the laser at different positions obtained by the laser beam accurately indicate that the upper welding arm is parallel to the lower abasement,and verify the accuracy of the levelling of the flip welding machine.The method system for studying the levelling problem of flip weld-ing machine is established for the first time,which lays a good foundation for efficiently solving the Z-direction pressure bias problem of flip interconnection process and improving the yield and reliability of infrared focal plane detector.