印制电路板盲孔电镀铜整平剂的合成及其性能

Synthesis and properties of levelling agents for copper electroplating of blind via of printed circuit board

[目的]采用2−甲基咪唑和1,4−丁二醇二缩水甘油醚为原料,合成印制电路板(PCB)盲孔电镀铜整平剂。[方法]使用红外光谱、核磁共振氢谱及凝胶色谱分析了投料温度不同时所得整平剂的结构。通过循环伏安曲线、阴极极化曲线、电化学阻抗谱和计时电位曲线测试,分析了整平剂对铜电沉积的影响,并通过电镀试验验证了它们用于盲孔电镀铜时的整平性能。[结果]投料温度为85℃时所得整平剂ADT-3的整平效果最好,盲孔填充率达94%。[结论]本研究合成整平剂所用原料易得、成本低,合成路线简单,整平效果良好,有望实现工业化生产。

[Introduction]A leveling agent for copper electroplating of blind via on printed circuit board(PCB)was synthesized using 2-methylimidazole and 1,4-butanediol diglycidyl ether as raw materials.[Method]The structures of the leveling agents synthesized at different feeding temperatures were characterized by infrared spectrometry,proton nuclear magnetic resonance spectroscopy,and gel chromatography.The effects of the leveling agents on copper electrodeposition were studied by cyclic voltammetry,cathodic polarization curve measurement,electrochemical impedance spectroscopy,and chronopotentiometry.Electrodeposition test was carried out to verify the performance of the leveling agents when applied to filling of blind vias.[Result]The leveling agent ADT-3 synthesized at a feeding temperature of 85℃ had the best leveling effectiveness as shown by a filling rate of 94%for blind vias.[Conclusion]The leveling agent synthesized in this study has the advantages of easy availability of raw materials,low cost,simple synthesis route,and good leveling effect.It is expected to realize industrialized production.