摘要
[目的]研究电解液中2-巯基噻唑啉(2-MTZ)浓度对电解铜箔组织结构、表面粗糙度、力学性能及电沉积行为的影响。[方法]采用钛板为基材,在由80 g/L Cu2+、100 g/L硫酸和0~20 mg/L 2-MTZ组成的电解液中直流电沉积制备铜箔。利用X射线衍射仪(XRD)、扫描电镜(SEM)、表面粗糙度仪、拉伸试验机和电化学工作站分析了所得铜箔的组织结构和性能。[结果]2-MTZ的加入能够细化铜箔晶粒,当2-MTZ的质量浓度为5mg/L时,铜箔展现出最均匀致密的表面,粗糙度最低,抗拉强度最高(约为525MPa)。循环伏安测试结果显示,2-MTZ能够增强铜电沉积过程的阴极极化。随着2-MTZ质量浓度增大,铜电沉积的形核密度先增大后减小,扩散系数逐渐降低。[结论]电解液中添加适量2-MTZ有利于获得微观结构和力学性能良好的电解铜箔。
[Introduction]The effect of 2-mercaptothiazoline(2-MTZ)concentration in electrolyte on the microstructure,surface roughness,mechanical properties,and electrodeposition behavior of electrolytic copper foil needs to be studied.[Method]Copper foils were prepared by direct-current electrodeposition with titanium plate as the substrate in an electrolyte consisting of Cu2+80 g/L,sulfuric acid 100 g/L,and 2-MTZ 0-20 mg/L.The microstructure and properties of the obtained copper foils were characterized by using X-ray diffractometer(XRD),scanning electron microscope(SEM),surface roughness tester,tensile testing machine,and electrochemical workstation.[Result]2-MTZ had the function of refining the grains of copper foil.The copper foil electrodeposited with 5 mg/L of 2-MTZ exhibited the most uniform and compact surface with the lowest surface roughness and the highest tensile strength(about 525 MPa).The result of cyclic voltammetric analysis showed that 2-MTZ could enhance the cathodic polarization during electrodeposition of copper.With the increasing mass concentration of 2-MTZ,the nuclear number density during copper electrodeposition was increased initially and then decreased,while the diffusion coefficient was gradually decreased.[Conclusion]Addition of appropriate amount of 2-MTZ to the copper electrodeposition electrolyte is beneficial to prepare electrolytic copper foils with good microstructure and mechanical properties.
作者
韩俊青
武玉英
杨祥魁
卢伟伟
HAN Junqing;WU Yuying;YANG Xiangkui;LU Weiwei(Key Laboratory of Liquid-Solid Structural Evolution and Processing of Materials,Ministry of Education,Shandong University,Ji’nan 250061,China;Shandong Jinbao Electronics Co.,Ltd.,Zhaoyuan 265400,China;School of Chemistry and Chemical Engineering,Henan University of Science and Technology,Luoyang 471003,China)
出处
《电镀与涂饰》
CAS
北大核心
2024年第11期16-23,共8页
Electroplating & Finishing
基金
国家重点研发计划(2021YFB3400800)
山东省泰山学者青年计划项目。
关键词
电解铜箔
2-巯基噻唑啉
电沉积
组织结构
力学性能
electrolytic copper foil
2-mercaptothiazoline
electrodeposition
microstructure
mechanical property