摘要
焊接反应生成的金属间化合物(Intermetallic Compound,IMC),以其良好的综合力学性能、稳定的化学性能以及与传统铜锡焊接材料的高适配性,成为应对芯片微型化、高功率化发展需求的优良焊点材料。依据堆叠芯片的典型结构进行简化建模,以全Cu_(6)Sn_(5) IMC焊点代替传统锡基焊点,利用有限元仿真软件COMSOL进行特征频率分析,得到前3阶固有频率及对应的振型,然后分析模型前3阶固有频率下的变形和受力情况。
Intermetallic Compound(IMC)generated by welding reaction,with its good comprehensive mechanical properties,stable chemical properties and high compatibility with traditional copper-tin welding materials,has become an excellent solder joint material to meet the needs of chip miniaturization and high power development.Based on the typical structure of stacked chips,this paper simplified the model,replaced the traditional tin-based solder joints with all Cu_(6)Sn_(5) IMC solder joints,and used the finite element simulation software COMSOL to carry out characteristic frequency analysis,obtaining the first 3 natural frequencies and corresponding vibration modes,and then analyzed the deformation and stress conditions under the first 3 natural frequencies of the model.
作者
操慧珺
蔡文智
朱鹏鹏
张志昊
CAO Huijun;CAI Wenzhi;ZHU Pengpeng;ZHANG Zhihao(College of Transportation Engineering,Xiamen City University,Xiamen 361008;College of Materials,Xiamen University,Xiamen 361005;Digital Twin Intelligent Transportation Maintenance Engineering Research)
出处
《现代制造技术与装备》
2024年第11期4-6,共3页
Modern Manufacturing Technology and Equipment
基金
厦门市自然科学基金联合项目“功率芯片封装用Cu纳米颗粒合成及烧结性能研究”(3502Z202474009)
厦门城市职业学院纵向配套科技项目“三维芯片封装用互连材料与工艺的研究”(ZXPTKJ202401)。
