一种具备长期失效短路能力的弹性压接型IGBT器件

Elastic Press-Pack IGBT Devices with Long-Term Short Circuit Failure Capability

压接型IGBT器件的失效短路模式(SCFM)可使其在失效之后仍能保持短路特性,在大规模器件串联应用中具有非常独特的优势,能够显著提高基于电压源换流器的高压直流(VSC-HVDC)(柔性直流)输电领域电力电子设备的可靠性。弹性压接器件由于封装结构限制,很难实现长期稳定运行。提出了一种新型弹性压接封装结构,采用失效短路电流再分配的方案,通过理论分析、仿真对比、试验测试等手段对该方案进行失效短路能力评估,相较传统结构导电片在1900 A、1 min熔断,优化后的导电片在2250 A、2 h下能够稳定保持最高温度≤200℃,为压接器件的开发提供了新的研究方向。

The short circuit failure mode(SCFM)of the press-pack IGBT devices allows them to maintain the short circuit characteristic after failure,which is a very unique advantage in the large-scale device series applications,and can significantly improve the reliability of power electronic equipment in the field of voltage source converter based high voltage direct current(VSC-HVDC)transmission.Elastic press-pack device is difficult to maintain long-term stable operation due to the limitation of package structure.A new elastic press-pack package structure that adopted a failure short circuit current redistribution scheme was presented.Through theoretical analysis,simulation comparison and experimental testing,the short circuit failure capability of the scheme was evaluated.The optimized conductor can maintain a stable maximum temperature of≤200 ℃ at 2250 A for 2 h while the traditional conductor burns down at 1900 A for 1 min.It provides a new research direction for the development of press-pack devices.