IC封装高速精密运动控制系统设计

Design of High Speed Precision Motion Control System for IC Packaging

为了满足现代工业对高速精密运动控制的需求,IC封装技术正逐步向高集成度与高性能方向发展。从IC封装技术概述及功能出发,阐述了IC封装的速度环、位置环及位置环与速度环联合控制方法,并利用TMS320系列DSP及HYE400运动控制卡分别设计了IC封装高速精密运动控制系统的运动控制器和运动控制软件系统,从而提高了IC封装的整体性能和精确度。

In order to meet the demand of modern industry for high-speed and precise motion control,IC packaging technology is gradually developing towards high integration and performance.Starting from the overview and functions of IC packaging technology,this article elaborates on the speed loop,position loop,and the joint control method of position loop and speed loop in IC packaging.Using TMS320 series DSP and HYE400 motion control card,the motion controller and motion control software system of the high-speed and precision motion control system in IC packaging are designed,thereby improving the overall performance and accuracy of IC packaging.