基于有限元仿真的航天器用高密度封装键合丝结构设计约束探究

Research on design constraints of high density package bonding wires for spacecraft based on finite element simulation

分析了一款航天器用高密度封装产品在宇航环境随机振动下的失效现象,并根据该产品的结构模型、应用条件建立了有限元仿真模型,仿真试验结果与失效分析的结果表明,该器件断键合丝在振动载荷作用下,分两步发生疲劳损伤与瞬间断裂,引起器件失效。根据该分析结果建立不同长度的键合丝模型,在航天器随机振动条件下的情况进行仿真,给出了航天器用高密度封装器件键合丝的长度控制要求。

This paper analyzes the failure phenomenon of a high-density packaged product for spacecraft under random vibration in the aerospace environment.Based on the structural model and application conditions of this product,a finite element simulation model is established.The results of simulation and failure analysis indicate that the device breaking bond wire under vibration loads undergo fatigue damage and instantaneous fracture in two steps,causing device failure.Based on this analysis,models with different bond wire lengths were established and simulated under random vibration conditions of spacecraft.