Sn-Zn-Bi-Ga掺杂Ti纳米颗粒钎料制备及钎焊性能

Preparation and brazing properties of Sn-Zn-Bi-Ga doped nano-Ti particle solder

为解决Sn-Zn系无铅钎料性能难以满足电子封装实际应用的问题,采用Ti纳米颗粒掺杂的方法制备了Sn-5Zn-10Bi-0.5Ga+x Ti无铅钎料(x为质量分数,分别取0.05%、0.1%、0.3%、0.5%),研究了Ti纳米颗粒对钎料的润湿性能、抗氧化性能的影响,对钎焊的钎焊接头界面处的组织结构、金属间化合物扩散层厚度特征,以及力学性能等影响。研究结果表明:Ti纳米颗粒的添加能提高钎料的润湿性能和抗氧化性能,还能改善界面处的组织结构和力学性能。当添加Ti纳米颗粒质量分数为0.3%时,钎料抗氧化性能最好,其氧化增重质量比最先趋于稳定且增长率最低,其焊件的剪切强度为32.10 MPa,达到最大值。

Sn-5Zn-10Bi-0.5Ga+xTi(x=0.05%,0.1%,0.3%,0.5%,mass fraction)was prepared by doping nano-particle Ti into the Sn-Zn-Bi-Ga solder matrix.The wettability and oxidation resistance of the solder were analyzed,and the microstructure of the solder joint interface,the thickness characteristics of the intermetallic compound(IMC)layer and the mechanical properties were studied.The results show that the addition of nanoparticle Ti can improve the wettability and oxidation resistance of the solder,and can also improve the microstructure and mechanical properties at the interface.When the oxidation resistance of solder is the best,the mass ratio of oxidation weight gain tends to be stable and the growth rate is the lowest when the content of Ti nanoparticles is 0.3wt.%.Meanwhile,the maximum shear strength of the weldment is 32.10MPa,when the mass fraction of Ti nanoparticles is 0.3%.