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电镀金刚石线锯的基线镀前脱除缺陷黄铜保护镀层技术的研究

Research on the Technology of Removing Defective Brass Protective Layer before the Baseline Plating for Electroplating Diamond Wire Saw
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摘要 以镀铜碳钢丝为基线,在其表面电镀镍与金刚石复合层制成金刚石线锯,用于高硬脆材料的切割。线锯高速切割时易发生扭转,若所镀复合层与基线结合力不佳则易分层导致线锯报废。现有技术制备的线锯存在复合层与基线结合力不适合高速切割的缺陷。在探讨其成因的基础上,设计了物理法基线镀前脱除缺陷黄铜保护镀层工艺和装置,可选择性脱除缺陷黄铜镀层,用于制备电镀金刚石线锯。结果表明:该技术可脱除基线表面的缺陷黄铜镀层,提高复合层与基线的结合力,制备的金刚石线锯可满足扭转、折断和破断试验的要求,适合高速切割。 The diamond wire saw is made by electroplating nickel and diamond composite layers on the surface of carbon steel baseline with copper coated,which is used for cutting high hardness and brittleness materials.The wire saw is prone to twisting during high-speed cutting,If the bonding force is poor between the composite layer and the baseline,it is easy to delaminate and cause the wire saw to be scrapped.The existing technology for preparation the wire saws has the defect that the bonding force between the composite layer and the baseline is not suitable for high-speed cutting.On the basis of exploring its causes,it was designed that the physical device for removing defective brass protective coatings before baseline plating.the device is used to selectively remove defective brass coatings and prepare electroplated diamond wire saws.The results show that this technology can remove the brass coating with defects on the baseline surface,improve the bonding force between the composite layer and the baseline,and produce diamond wire saw that can meet the requirements of torsion and breaking tests,and be suitable for high-speed cutting.
作者 王太信 朱红梅 严兴朝 吕忠光 邵树锋 WANG Tai-xin;ZHU Hong-mei;YAN Xing-chao;LV Zhong-guang;SHAO Shu-feng;无(Zhejiang LING ZHOU Intelligent Equipment Co.,Ltd.,Shaoxing 312000,China;Zhejiang MEIKE Photoelectricity Co.,Ltd.,Shaoxing 312000,China;China Quality Mark Certification Group Zhejiang Co.Ltd.,Hangzhou 310000,China;Zhejiang Industry Polytechnic College,Shaoxing 312000,China)
出处 《世界有色金属》 2024年第20期51-53,共3页 World Nonferrous Metals
基金 2023年浙江省级新产品试制计划项目(2023D60SA6910572)。
关键词 电镀金刚石线锯 基线 镀前处理工艺 脱除缺陷黄铜镀层 Electroplated diamond wire saw Baseline Plating pre-treatment Removal of defective brass plating layer
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