安徽某铜矿絮凝剂选型优化试验

Optimization Experiment of Flocculant Selection for a Copper Mine in Anhui Province

为探究安徽某铜矿尾砂浓密絮凝特性及选择合适的絮凝剂,针对当前尾砂脱水使用的深锥浓密机底流浓度偏低无法满足充填工艺要求、絮凝剂添加量过大导致成本增加及生产循环水污染等问题,通过对尾砂进行物理性质测定、静态浓密试验、动态浓密试验等特性分析,探究其粒级组成、真密度及实验室条件下的适宜絮凝剂产品型号和药剂制度,并分别开展了6种型号的絮凝剂工业试验研究。试验结果表明:安徽某铜矿尾砂粒径较细,采用水筛筛分法,-75μm占75.34%,-37μm占50.43%,尾砂真密度为2.702 g/cm^(3);SYS-2型絮凝剂的最佳添加量为35 g/t,工业试验研究验证,C、E、F 3款絮凝剂可实现尾砂浓度在63%以上且产品单耗较低,满足尾砂脱水生产需求;絮凝剂在0.2%制备浓度条件下,尾砂絮凝效果接近且絮凝剂单耗大幅降低,絮凝剂在制备槽中停留时间更长且熟化更充分,可实现更好的絮凝效果。

In order to explore the thickening and flocculation characteristics of tailings in a copper mine in Anhui Province and select the appropriate flocculant,aiming at the problems that the underflow concentration of deep cone thickener used in tailings dewatering is too low to meet the requirements of filling process,the cost increase caused by excessive flocculant addition and the pollution of production circulating water,the particle size composition,true density and suitable flocculant product model and reagent system under laboratory conditions are explored by analyzing the physical properties of tailings,static thickening test and dynamic thickening test,and six types of flocculant industrial tests are carried out respectively.The test results show that the particle size of tailings in a copper mine in Anhui is fine,-75μm accounts for 75.34%,-37μm accounts for 50.43%by the water sieve screening method,and the true density of tailings is 2.702 g/cm^(3).The optimum addition amount of SYS-2 flocculant is 35 g/t.The industrial test verifies that the three flocculants of C,E and F can achieve the tailings concentration of more than 63%and the unit consumption of the product is low,which meets the needs of tailings dewatering production.Under the condition of 0.2%preparation concentration of flocculant,the flocculation effect of tailings is close and the unit consumption of flocculant is greatly reduced.The flocculant has a longer residence time in the preparation tank and is more fully matured,which can achieve better flocculation effect.