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智慧电视主板失效分布及可靠性评估研究

Research on Failure Distribution and Reliability Evaluation of Smart TV Main Board
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摘要 对智慧电视主板进行了极限工作温度摸底,得到主板的极限工作温度。采用热成像技术在常温和高温下对主板进行了温度场分析,发现主板的热薄弱环节是因高温老化造成背光电源开关MOS失效。根据上述结果,基于加速寿命试验原理,采用Arrhenius模型得到加速寿命试验的加速因子。通过对主板进行温度加速试验并收集失效数据,对失效数据进行分析,建立了失效分布模型。通过对失效分布的参数进行了估计,得到主板的基础失效率为0.71×10-6/h,同时给出了主板不同使用环境下的环境系数。 The maximum working temperature of the smart TV main board is tested and the maximum working temperature of the main board is obtained.Thermal imaging technology is used to analyze the temperature field of the main board at room temperature and high temperature,and it is found that the thermal weak link of the main board is caused by high temperature aging,resulting in MOS failure of the backlight power switch.According to these results,based on the principle of accelerated life test,the accelerated factor of accelerated life test is obtained using the Arrhenius model.By conducting temperature accelerated test on the main board and collecting failure data,the failure data is analyzed and a failure distribution model is established.By estimating the parameters of the failure distribution,the basic failure rate of the main board is obtained to be 0.71×10-6/h.At the same time,the environmental coefficients of the main board under different usage environments are provided.
作者 李立宇 卓剑锋 LI Liyu;ZHUO Jianfeng(Guangzhou Jingce Testing Technology Co.,Ltd.,Guangzhou 510000,China)
出处 《现代信息科技》 2024年第24期12-15,共4页 Modern Information Technology
关键词 智慧电视主板 故障分布 加速试验 smart TV main board fault distribution accelerated test
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