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Development of Novel Binder for Hardmetal Powder Extrusion Molding

Development of Novel Binder for Hardmetal Powder Extrusion Molding
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摘要 A novel binder system for hardmetal powder extrusion moulding (PEM) process has been developed. The binder system comprises a major fraction of a mixture of low molecular weight components (LMWCs) and a minor fraction of very finely dispersed polymer. The feedstocks are mixed as a thick slurry at a suitable temperature and are rapidly homogenized by stirring at an adequate shear force. The binders are removed by thermal debinding. The thermal debinding mechanism has been investigated by thermogravimetry (TG) and differential thermogravimetry (DTG). At the first stage of debinding, the LMWCs are removed. These open up pore channels which allows much faster removal of the remaining polymer component during the subsequent stage. The microstructures of the moulded green parts were observed by scanning electron microscopy (SEM). The debound samples were sintered at different temperatures, and the sintered samples properties were measured. A novel binder system for hardmetal powder extrusion moulding (PEM) process has been developed. The binder system comprises a major fraction of a mixture of low molecular weight components (LMWCs) and a minor fraction of very finely dispersed polymer. The feedstocks are mixed as a thick slurry at a suitable temperature and are rapidly homogenized by stirring at an adequate shear force. The binders are removed by thermal debinding. The thermal debinding mechanism has been investigated by thermogravimetry (TG) and differential thermogravimetry (DTG). At the first stage of debinding, the LMWCs are removed. These open up pore channels which allows much faster removal of the remaining polymer component during the subsequent stage. The microstructures of the moulded green parts were observed by scanning electron microscopy (SEM). The debound samples were sintered at different temperatures, and the sintered samples properties were measured.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2002年第6期569-571,共3页 材料科学技术(英文版)
基金 This research was supported by the National Natural Science Foundation of China (grant No.5964120, No.69971007). The financial support is gratefully acknowledged.
关键词 BINDER Thermal debinding Hardmetal powder extrusion moulding Binder, Thermal debinding, Hardmetal powder extrusion moulding
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参考文献13

  • 1[1]J.C.Zhou, B.Y.Huang, E.X.Wu and X.H.Qu: Trans. Nonferrous Met. Soc. China, 1997, 7(4), 107.
  • 2[2]J.C.Zhou, B.Y.Huang and E.X.Wu: Trans. Nonferrous Met.Soc. China, 2000, 10(5), 639.
  • 3[3]K.A.Friedrichs: Proc of 13th Plansee Seminar, 1993, 2, 468.
  • 4[4]I.A.Friedrichs: Proc of 14th Plansee Seminar, 1995, 1, 321.
  • 5[5]H.M.Shaw and M.J.Edirisihghe: Philos. Mag. A, 1995, 72(1),267.
  • 6[6]I.E.Pinwil: J. Mater. Sci., 1992, 27, 4381.
  • 7[7]H.H.Angermann and O.V.Biest: Int. J. Powder Metall., 1993,29(3), 239.
  • 8[8]R.M.German: Int .J. Powder Metall., 1987, 23(4), 237.
  • 9[9]P.J.Jarnes: Proc of 13th Plansee Seminar, 1993, 2, 121.
  • 10[10]Jicheng ZHOU, Baiyun HUANG and Enxi WU: Chinese J.Nonferrous Metals, 1998, 8(4), 647. (in Chinese)

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