聚二甲基硅氧烷基质微流控芯片封接技术的研究

Studies on Bonding Techniques for Poly(dimethylsiloxane) Microfluidic Chips

考察了聚二甲基硅氧烷 ( Polydimethylsiloxane,PDMS)预聚体与固化剂间的配比、固化温度及固化时间对 PDMS芯片封接强度的影响 ,得出 PDMS芯片封接的最佳条件基片和盖片所用 PDMS预聚体与固化剂质量配比分别为 1 0∶ 1与 5∶ 1 ,固化温度为 75℃ ,固化时间分别为 35～ 5 0 min和 2 5～ 4 0 min,封接后继续加热 6 0 min.在该条件下封接制作的微芯片历经半年 5 0多次的分析、冲洗及抽液后未见明显损坏 ,足以满足一般分析任务的要求 ,并将芯片成功用于两种氨基酸的快速毛细管电泳分离 .

In this paper the procedure was discribed for enclosing PDMS substrate containing microstructures with a flat piece of PDMS cover plate to fabricate PDMS microfluidic chips. The effects of proportions of PDMS prepolymer and curing agent, curing temperature and time on the bonding strength of PDMS wafers were investigated. The optimal mass proportions were 10∶1 for substrate and 5∶1 for cover plate. The optimal curing time for substrate and cover plate was 35-50 min and 25-40 min, respectively, at 75 ℃. The surface of the substrate and that of the cover plate seal tightly and irreversibly when brought into close contact and continue cured for 60 min at 75 ℃. The chips have been used successfully for the separation of two FITC labeled amino acids and worked well within a period of six months with more than 50 cycles of operations involving solution loading in the channel and channel washing.