摘要
综述了化学镀铜的应用领域 ,化学镀铜工艺的研究进展 ,简述了化学镀铜机理的研究现状 。
A review is made on the application areas and the development of technics of electroless copper plating. The research works on the mechanism of electroless copper plating are also summarized. Some research problems needed to be settled in the future are indicated.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2002年第6期5-6,11,共3页
Surface Technology
关键词
化学镀铜
进展
工艺
机理
Electroless copper plating
Technics
Mechanism
