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非原生掺杂半绝缘磷化铟(InP)及其应用对比 被引量:1

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摘要 过去的几年中, 由于1.31和1.55 (m波长半导体激光器在光纤通信领域得到了广泛的应用, 磷化铟(InP)衬底材料的研究和规模化生产因此受到了极大的推动, 并已逐步成为继硅(Si)和砷化镓(GaAs)之后又一重要的化合物半导体材料. 与GaAs相比, InP晶体具有高的饱和电场漂移速度、良好的导热性和较强的抗辐射能力等优点, 因此更适合于制造高频、高速、大功率及外层空间用微波器件和电路[1~3]. 从实际使用的情况看, n和p型InP衬底的性能已基本满足要求, 而半绝缘类型衬底则无论从一致性还是均匀性方面都需要较大程度地改善. 相应地, 这种改善的途径和方法已成为半导体材料的研究热点之一[4~9].
出处 《科学通报》 EI CAS CSCD 北大核心 2002年第23期1761-1762,共2页 Chinese Science Bulletin
基金 中国科学院半导体研究所材料中心科研发展基金资助项目
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参考文献15

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同被引文献14

  • 1孙聂枫,周晓龙,陈秉克,孙同年.InP单晶材料现状与展望[J].电子工业专用设备,2005,34(10):10-14. 被引量:10
  • 2杨勋,戴剑,王世超,邓爱红.非掺杂半绝缘态InP中补偿缺陷正电子寿命谱的研究[J].四川大学学报(自然科学版),2006,43(1):129-133. 被引量:1
  • 3Dr adarsh sandhu. Monitoring eyes on indium phosphide [J]. Ⅲ - Vs REVIEW,2004,17(5) :31 -33.
  • 4Sun Fung, Zhao Youwen, Sun Niefeng et al. H - vacancy complex VInH4 abundance and its influences in n - type LEC InP[J]. Journal of crystal growth 2000,211:174 - 178.
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  • 6Fornari R, Gilioli E, Sentiri A et al. Homogeneity of thermally annealed Fe - doped InP wafers [ J ]. Materials science and engineering : B, 1997,44 ( 1 - 3 ) : 233 - 237.
  • 7Zhao Y W, Xu X L, Gong Met al. Formation of Pin defect in annealed undoped LEC InP [ J ]. Appl Phys Lett, 1998(72) :2126 - 2128.
  • 8Zhao Youwen, Dong Hongwei, Jiao Jinghua et al. Preparation of Semi - Insulating Material by Annealing Undoped InP[ J].半导体学报,2002,23(3):285-289.
  • 9Gail Purvis. The idiom of InP [ J ].Ⅲ - V s REVIEW, 2004,17 (3 ):35 -38.
  • 10赵有文,苗杉杉,董志远,吕小红,邓爱红,杨俊,王博.磷化铟中铁原子替位与填隙的热致转变及其对材料性质的影响[J].物理学报,2007,56(9):5536-5541. 被引量:2

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