摘要
阐述了温度补偿封装技术的基本原理和结构设计方法 ,并对封装后的光栅作了温度性能测试。其布拉格波长对温度的敏感性已降低到 0 .0 0 0 8nm/℃ 。
The principle and structure design of temperature compensation package for FBGs are expatiated, temperature characteristic of packaged FBGs is measured. The temperature sensitivity for compensated FBGs has been decreased to 0.000 8 nm/℃, and the result reaches applicable level.
出处
《铁道学报》
EI
CAS
CSCD
北大核心
2002年第6期66-68,共3页
Journal of the China Railway Society
