压力敏感元件的硅-玻璃-金属封接技术

A Silicon-Glass-Metal Bonding Technique for Pressure Sensors

利用电场和温度将硅—玻璃—金属三者一次性紧密封接在一起。采用这种工艺技术制造出的硅压力敏感元件强度高、气密性好,提高了稳定性和可靠性。

By using an electric field and at certain temperature, Silicon, glass and metal are tightlybonded at one time.Silicon pressure sensors made with this technique have high strength and good air tightness and the stability and reliability of the devices, are improved.