化学镀Ni-Cu-P添加剂的研究

A Study of the Additives for Electroless Plating Ni-Cu-P

通过对化学镀Ni Cu P合金的稳定剂、表面活性剂、光亮剂对镀层性能及镀液稳定性的影响研究 ,得出最佳实验配方。

The performance of Ni Cu P alloy layer and stabilizing property of Ni Cu P solution are studied by adding stabilizing agents , surface active agents, brightening agents. The best experimental formulation is proposed.