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超亲水多孔表面制备及其池沸腾换热研究 被引量:8

Preparation and Pool Boiling Heat Transfer Test of Super-hydrophilic Surface
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摘要 采用电沉积法制备了纳米级树枝状结构与微米级孔穴结构复合的多孔表面,分析了电镀时间对多孔表面结构的影响,制备的多孔表面孔隙率最高可达94.4%,且具有超亲水特性。建立了多孔表面的去离子水池沸腾换热实验系统,对比研究了多孔表面与平表面的池沸腾换热性能,结果表明,多孔表面的临界热流密度239 W/cm^2,最高对流换热系数5.9W/(cm^2K),分别比平表面提高了100%和120%。 Porous surfaces were fabricated with the electrochemical method.The effect of deposition time on surface morphology was investigated.Experiment result indicated that the porous surface comprised nano-scaled structure and micro-pore structure.The highest porosity of the surfaces could reach to 94.4%,furthermore,some showed super-hydrophilic characteristic.Pool boiling heat transfer experiment were performed with de-ionized water as working fluid at atmosphere pressure.The critical heat flux and highest heat transfer coefficient of the porous reached up to 239 W/cm^2 and 59kW/cm^2,100%and 120%higher than that of plain copper surface respectively.
出处 《工程热物理学报》 EI CAS CSCD 北大核心 2014年第8期1606-1609,共4页 Journal of Engineering Thermophysics
基金 国家自然科学基金资助项目(No.51225602)
关键词 多孔表面 超亲水表面 池沸腾 电沉积法 porous surface super-hydrophilic surface pool boiling electrochemical method
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参考文献4

  • 1Yongping Yang,Xianbing Ji,Jinliang Xu.Pool boiling heat transfer on copper foam covers with water as working fluid[J].International Journal of Thermal Sciences.2010(7)
  • 2Seontae Kim,Hyung Dae Kim,Hyungmo Kim,Ho Seon Ahn,Hangjin Jo,Joonwon Kim,Moo Hwan Kim.Effects of nano-fluid and surfaces with nano structure on the increase of CHF[J].Experimental Thermal and Fluid Science.2009(4)
  • 3.Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition[J].Electrochimica Acta.2007(28)
  • 4H.‐C.Shin,J.Dong.Nanoporous Structures Prepared by an Electrochemical Deposition Process[J].Adv Mater.2003(19)

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