固态风扇耦合半导体制冷系统仿真研究

Numerical Simulation on a Semiconductor Cooling System Coupling With Solid-state Fans

固态风扇耦合半导体制冷系统克服了常规利用机械风扇散热的半导体制冷系统所导致的振动与噪音等问题,能更好地发挥出半导体制冷技术所具有的安静、紧凑等固有优势。为此,本文基于COMSOL多物理场仿真软件,建立了固态风扇耦合半导体制冷系统二维数学物理模型。仿真结果表明,冷端温度与半导体致冷片性能系数(COP_t)和耦合系统性能系数(COP_s)之间呈单调递增关系,环境温度与COP_t和COP_s之间呈单调递减关系。固态风扇的结构参数(放电极垂直高度H、放电极半径r、散热截面宽度W)以影响热端散热的形式与半导体致冷片之间发生复杂的强耦合,放电极半径r与半导体致冷片和固态风扇耦合半导体制冷系统性能系数之间呈单调递减关系,并存在最佳的放电极高度H和最佳的散热截面宽度W使固态风扇耦合半导体制冷系统获得最大的性能系数。

A semiconductor cooling system coupling with solid-state fans overcomes the problems of vibration and noise by the conventional semiconductor cooling system utilizing mechanical fan for heat dissipation.The inherent advantages of quietness and compactness of the semiconductor cooling technology could be exerted better.Therefore,based on COMSOL software,a two-dimensional mathematical model of the semiconductor cooling system coupling with solid-state fans is established in this paper.The simulation results show that there is a monotonous increasing relationship between the cold side temperature and the performance coefficient of the semiconductor chip(COP_t)and the performance coefficient of the semiconductor cooling system coupling with solid-state fans(COP_s).And there is a monotonous decreasing relationship between the ambient temperature and COP_t and COP_s.Structure parameters(vertical height of the electrode H,discharge wire radius r,the width of the heat dissipation section W)of the solid-state fan have a complex and strong coupling with the semiconductor cooling plate by affecting the cooling of hot side.The discharge wire radius r has a monotonous decreasing relationship with the COP_t and COP_s,and there exists the best discharge wire height H and the optimal width of the heat dissipation section W to make the semiconductor cooling system coupling with solid-state fans obtain the largest coefficient of performance.