期刊文献+

Ⅴ/Ⅲ对P型GaP掺杂及红光LED量子效率的影响

The influence of Ⅴ/Ⅲ ratio to doping in P—GaP and Red LED
原文传递
导出
摘要 利用低压金属有机物化学气相沉积(LP-MOCVD),对红光发光二极管(LED)的窗口层掺杂进行研究。分别在Ⅴ/Ⅲ比为13、26和52的情况下生长GaP材料,结果发现,Ⅴ/Ⅲ比影响Mg的掺杂浓度和载流子迁移率。在上述Ⅴ/Ⅲ比下生长的GaP,外延生长出红光LED外延片并制备器件,结果发现,生长GaP层时,Ⅴ/Ⅲ比为52的红光LED与Ⅴ/Ⅲ比为13相比,输出光功率提高了23.7%,轴向光强提高了20.4%。 The doping characteristics in the window layer of red LED have been studied in LP-MOCVD system.GaP material has been grown when V/ⅡI ratios are 13,26 and 52,respectively.The experimental results indicate that V/ⅡI ratio effects carrier concentration and mobility.Finally,red LED with GaP window layer has been fabricated,where GaP has been grown under the above-mentioned V/ⅡI ratios.The result shows that the output power of LED with GaP layer,in which the V/ⅡI is 52,is increased by 23.7% in contrast with LED with GaP layer in which V/ⅡI is 13,while the light intensity increases20.4%.
出处 《光电子.激光》 EI CAS CSCD 北大核心 2009年第7期867-869,共3页 Journal of Optoelectronics·Laser
基金 国家自然科学基金资助项目(60506012) 北京市科委重点资助项目(D0404003040221) 北京市人才强教计划资助项目(05002015200504) 北京工业大学第六届研究生科技基金资助项目
  • 相关文献

参考文献1

二级参考文献15

  • 1[1]Kato T, Susawa H, Hirotani M, et al. GaAs/GaAlAs surface emitting IR led with bragg reflector grown by MOCVD [J]. J Cryst Growth, 1991, 107: 832.
  • 2[2]Ishikawa M, Shiozawa H, Itaya K, et al. Temperature dependence of the threshold current for InGaAlP visible laser diodes [J]. IEEE J Quantum Electron, 1991, 27: 23-29.
  • 3[3]Yablonovitch E, Huang D M, Gmitter T J, et al. Van der waals bonding of GaAs epitaxial liftoff films onto arbitrary substrates [J]. Appl Phys Lett, 1990, 56: 2419.
  • 4[4]Schnitzer I, Yablonovitch E, Caneau C, et al. Ultrahigh spontaneous emission quantum efficiency, 99.7% internally and 72% externally from AlGaAs/GaAs/AlGaAs double heterostructures [J]. Appl Phys Lett, 1993, 62: 131.
  • 5[5]Adachi S, Oe K. Chemical etching characteristics of (001)GaAs [J]. J Elcetrochem Soc, 1983, 130: 2427.
  • 6[6]Liau Z L, Mull D E. Wafer fusion: A novel technique for optoelectronic device fabrication and monolithic integration [J]. Appl Phys Lett, 1990, 56: 737.
  • 7[7]Kish F A, Steranka F M, Defevere D C, et al. Vary high-efficiency semiconductor wafer-bonded transpatent-substrate (AlxGa1-x)0.5In0.5P/GaP light-emitting diodes [J]. Appl Phys Lett, 1994, 64: 2839.
  • 8[8]Hofler G E, Vanderwater D A, Defevere D C, et al. Wafer bonding of 50-mm diameter GaP to AlGaInP light-emitting diode wafers [J]. Appl Phys Lett, 1996, 69(6): 803.
  • 9[9]Benisty H, Deneve H, Weisbnch C. Impact of planar microcavity effects on light extraction-Part I: bacic concepts and analytical trends [J]. IEEE J Quantum Elcetron, 1998, 34(9): 1312.
  • 10[10]Krames M R, Ochiai-Holcomb M, Hofler G E, et al. High-power truncated-inverted-pyramid (AlxGa1-x)0.5In0.5P/GaP light-emitting diodes exhibiting>50% external quantum efficiency [J]. Appl Phys Lett, 1999, 75: 2365.

共引文献17

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部