室温固化高低温使用环氧胶粘剂的制备与性能

Preparation and Properties of Room Temperature Curing Epoxy Adhesive Used in Wide Range of Temperature

研究了一种在-150℃~100℃宽温度范围具有较高剪切和剥离强度,并且能够承受液氮温度(-196℃)~150℃冷热冲击的室温固化环氧胶粘剂体系。探讨了促进剂2,3,4-三(二甲胺基甲基)苯酚(DMP30)的最佳用量,考察了不同固化时间及后固化工艺对胶粘剂固化度、玻璃化转变温度和力学性能的影响。结果表明,适量DMP30的添加有利于提高固化物的力学性能,后固化可以提高固化物的固化度和拉伸强度,但对于已处于玻璃态的固化物的性能影响很小。当胶粘剂的本体强度达到一定值后,体系固化度和玻璃化转变温度与其剪切强度的关系不大,后固化对其本体强度的提升不能带来粘接强度的相应明显提高。

A room temperature curing epoxy adhesive system was studied,which had high shear and peel strength between- 150 ℃ and 100 ℃,and also excellent high and low temperature cycle resistance from liquid nitrogen temperature to 150 ℃. The optimum content of curing accelerator tris( dimethylaminomethyl) phenol was determined,and the influences of the curing time and post-curing on the curing degree,glass transition temperature and mechanical properties of the adhesives were also investigated. It is concluded that addition of tris( dimethylaminomethyl) phenol with proper content is good for improvements of the mechanical properties of the adhesive systems,and the curing degree and tensile strength are enhanced through post-curing which has little influence on the toughness of the cured adhesive systems.When the adhesive shear strength reaches a certain value,the increased curing degree and glass transition temperature in the adhesive systems via post-curing do not consequently result in the shear strength increased significantly.