印刷电路板孔内无铜产生原因的研究

Study on the Causation of Having No Copper in the Holes of the Printed Circuit Board

孔内无铜是造成印刷电路板产品报废的原因之一,本文用切片显微方法,从生产工序研究孔内无钢产生的原因,根据生产流程提出一些改善措施,提高了产品合格率。

Having no copper in the holes is one of the reasons that cause the discarding of the printed circuit board. The causation of the phenomena is studied by the method of using microscope slice. And aiming at enhancing the eligibility ratio,some improving measures are put forward according to the producing flow.