摘要
论述超细金丝在电子工业中的应用状况和发展。涉及金丝作为热压键合引线的重要性,金丝的工作条件和性能要求,微量元素对金丝的力学性能、再结晶温度、成球特性及热压健合中回线形状和键合强度的影响。还讨论了金丝力学性能指标的不足和局限性以及需要解决的某些问题。
The application, present state and development of super fine gold wire for electronic industry were expounded all-round and brifly. It included the importances of gold wire as bonding wite, its working conditions and propotties. The effects of the various trace dements on its mechanical properties, recrystallization temperature, forming ball ability, looping and bonding strength were summarized. The shortcomings and limitations to the mechanical property indexes for gold wire were discussed.
出处
《贵金属》
CAS
1988年第2期32-40,共9页
Precious Metals
