芯片粘接空洞的超声检测工艺研究

The Study of Ultrasonic Detection Process of Chip Adhesive Void

基于超声检测原理,提出一套针对芯片粘接空洞的超声检测工艺,并通过理论分析与试验结果进行检测工艺适用性的验证,为利用超声检测手段检测和评价芯片粘接质量提供保证。

Based on ultrasonic detection principle,a set of ultrasonic detection process is summed up for chip adhesive void,and examples are presented for verifying the feasibility of the process,and provide reference for ultrasonic detection and evaluation of adhesive quality using ultrasonic detection method.