5HUEBENER R P, TSUEI C C. Prospects for cooling of superconducting electronics [J]. Cryogenics, 1998,38:325-328.
6METZGER T, HUEBENER R P. Modelling and cooling behaviour of Peltier cascades [J]. Cryogenics, 1999,39: 235-239.
7MIN G, ROWE D M, KONTOSTAVLAKIS K. Thermoelectric figure-of-merit under large temperature differences [J]. J Phys D:Appl Phys, 2004, 37(8):1301-1304.
8NUWAYHID R Y, MOUKALLED F. Evolution of power and entropy in a temperature gap system with electric and thermoelectric influences [J]. Energy Convers Mgmt, 2003, 44(5): 647-665.
9魏小龙.MSP430系列单片机技术及系统设计实例[M].北京:北京航空航天大学出版社,2002.
10Thermoelectric Cooling Systems Design Guide[M].Dallas, Texas:Marlow Industries,Inc, 1998.
