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飞秒激光烧蚀研究进展 被引量:16

Research Progress of Femtosecond Laser Ablation
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摘要 介绍飞秒激光烧蚀材料的机理及理论模型,阐述飞秒激光烧蚀的特性,揭示飞秒激光烧蚀的广泛应用前景. The mechanism and the theoretical model of femtosecond laser ablation of materials are introduced, the properties of femtosecond laser ablation are explained, and the widespread application prospect is described.
出处 《激光与光电子学进展》 CSCD 2002年第12期4-9,共6页 Laser & Optoelectronics Progress
关键词 飞秒激光 烧蚀 微细加工 材料迁移 阈值 micromachining,femtosecond laser ablation, material, removal
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参考文献27

  • 1Hiroshi Kumagai, Katsumi Midorikawa, Koichi Toyoda, Ablation of polymer films by a femtosecond high-peak-power Ti:sapphire laser at 790nm. Appl. Phys. Lett., 1994, 65(14): 1850-1852
  • 2P. Pronkio, S. Outta, J. Squier et al.. Machining of sub-micron holes using a femtosecond laser at 800nm. Opt. Commun., 1995, 114:106-110
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  • 7M. Lenzner, F. Kraiisz, J. Kruger et al., Photoablation with sub-10 fs laser pulses. Appl. Surf. Sci., 2000, 1544-155:11 - 16
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