铝钎料膏的研制及其在钎焊中的应用

Aluminum solder paste and its application

研制了铝硬钎焊用钎料膏 ,对其工艺性能进行了研究。将钎料粉分离成不同的颗粒度配制成钎料膏进行实验 ,结果表明随着钎料粉颗粒度的增加 ,钎料膏的流动性和填缝性能力增强 ,在保证钎料膏能填缝的前提下 ,钎料粉的颗粒度越大 ,所需钎剂的量越小 ,可以降低钎料膏的成本。用Al Si共晶合金粉、氟化物钎剂和粘结剂按适当比例配制成膏状 ,确定了钎料膏各组分的最佳配比及其焊接工艺参数 ,实验表明配制的钎料膏具有较好的焊接性能和焊缝成型性。

A solder paste used for brazing was developed and its technical performance was investigated. The experimental results show that the spread ability and the clearance fill ability of the solder paste increase with the increase of grain size of Al-Si metal powder. With the precondition of the nicer clearance fill ability of the solder paste, a small amount of flux and bigger grain size of Al-Si are in favor of the reduce of cost. The solder paste was executed with Al-Si eutectic metal power, nocolok brazing flux and organic fibrin binder according to some proportion. Brazing parameters and the optimal composition proportion of the solder paste were decided. The results show that the solder paste take on favorable brazing ability and nicer clearance fill ability.