用Al作中间层的Si_3N_4陶瓷的扩散焊接

Diffusion Joining of Si3N4 Joints With Al Interlayers

在温度为600℃、压强为30MPa和保温2h的条件下,成功地实现了Si3N4/Al/Si3N4试样的真空扩散连接。用SEM和EPMA方法进行的连接机理分析表明,Si3N4和Al的连接是通过有限的原子相互扩散实现的。用SEM和EDXA方法研究了Si3N4/Al界面的断口。结果表明,Si3N4/Al界面的断裂模式属于界面脆性剥离。

Under the conditions of temperature 600℃,pressure 30MPa and continuing them for 2 hours,the vacuum diffusion joining of Si3N4/Al/Si3N4 specimens was realized successfully .The joining mechanism was analyzed by SEM and EPMA methods.The results show that the joining is realized through the limits atoms'diffusion between Si3N4 and Al.The fracture surface of the Si3N4/Al interface has been analyzed by SEM and EDXA methods,and the results prove that the fracture pattern of Si3N4/Al interface belongs to interface brittle debonding.